EPC GaN Experts show how to develop a full wafer-level chip-scale packaged (WLCSP) footprint design from an EPC product datasheet.
0:00 Start
0:36 Footprint Design Agenda
1:25 Overview of EPC BGA & LGA Footprints
1:46 Footprint Terminology
2:53 Datasheet Footprint Design Information
3:07 Datasheet Landpad Design Information
3:28 Datasheet Stencil Design Information
3:51 Complete BGA Footprint Design
4:20 Landpad Design Comparison: Non-Solder Mask Defined vs. Solder Mask Defined
5:04 Benefits of Solder-Mask Defined
6:10 Copper Pad Design
7:34 EPC Recommended Footprint Design
8:38 Silkscreen Design
9:22 3D Model/Mechanical Data
9:58 Footprint Design Example: Step by Step Instructions from Datasheet to Finished Footprint Design
12:50 Online Design Resources