Are your RF prototypes performing as expected or are material choices holding you back? In this video, we break down everything you need to know about selecting low-loss materials for your RF and microwave PCB designs.
Material selection directly impacts RF prototype performance, influencing signal integrity, insertion loss, and manufacturability. Whether you’re working on high-speed communications, radar, or advanced RF applications, understanding the nuances of dielectric constant (Dk), dissipation factor (Df), and CTE is critical for your design success.
Alex Ippich, Technical Director of Signal Integrity at Isola, shares the latest advancements in low-loss RF laminates, explaining the role of copper roughness, oxide replacement, and loss tangent in minimizing signal loss. He also explores practical testing methods for Dk/Df values and how measurement techniques like TDR and VNA impact material characterization.
Amit Bahl, CRO at Sierra Circuits, brings a fabrication perspective to the discussion, highlighting real-world challenges with RF materials—from signal propagation delays to board warping—and what you need to know to ensure your designs are manufacturable, reliable, and repeatable.
What you’ll learn:
• Why PCB material selection is critical for RF prototype performance
• Key factors in choosing laminates for RF and microwave designs
• Fabrication challenges with low-loss RF materials
• PTFE vs. non-PTFE materials: pros, cons, and when to choose each
• Benefits of hybrid stack-ups for RF boards
• How copper roughness impacts insertion loss in high-frequency designs
• The significance of oxide replacement, loss tangent, and via stubs
• Surface finish selection for RF applications
• Best practices for testing Dk/Df and characterizing material properties
• The evolution of RF test methods for blank PCBs
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