FED Conference Talk 03.12.2020
Thema: PCB Stack-Up design - Glass-Style and Dielectric Loss considerations
Referent: Edgar Merger – Sr Lead Electronic Hardware Engineer, Emerson Machine Automation Solutions
Veranstalter:
FED e.V.
Fachverband für Design,
Leiterplatten- und Elektronikfertigung
Frankfurter Allee 73c
10247 Berlin
Tel. +49(0)30 340 6030-50
info@fed.de
www.fed.de